About: http://webisa.webdatacommons.org/422531889

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is an electronic package leadframe architecture and method for arranging multiple optocoupler die pair devices in a minimum single standard outline package.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com