About: http://webisa.webdatacommons.org/422719315

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This is useful in changing the grain structure of the metallic copper layer to enhance conductivity and other physical properties, such as stress relief, in IC chip applications.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com.au