About: http://webisa.webdatacommons.org/426727779

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	A CMP slurry of the present invention is usable to fill in holes other than vias or contacts and is usable for polishing metals other than tungsten, tungsten silicide or titanium nitride.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com