| http://www.w3.org/ns/prov#value | - A lip 9 is formed near the outer periphery of the heat spreader lid 16 to enable the lid to be bonded to the underlying substrate board 10. [0019] The heat spreader lid 16 is typically composed of a high thermal conductivity material, such as copper, aluminum, or a metal matrix composite having thermal conductivity in excess of 100 Watts/meter ??? K. (W/m ??? K.).
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