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About: http://webisa.webdatacommons.org/433873265

PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Micron Technology, Inc. (Boise, ID)International Classification: H01L 2156U.S. Classification: 438127Abstract: A packaged LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame.
http://www.w3.org/ns/prov#wasQuotedFrom
  • radaris.com