About: http://webisa.webdatacommons.org/435696637

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This includes standard IC interconnect technology (i.e. growing metal layers of Al, AlCu or Cu for instance), andstandard assembly interconnect technology, such as the use of metal or solder bumps or anisotropically conducting glue.
http://www.w3.org/ns/prov#wasQuotedFrom	patentgenius.com