PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • This includes standard IC interconnect technology (i.e. growing metal layers of Al, AlCu or Cu for instance), andstandard assembly interconnect technology, such as the use of metal or solder bumps or anisotropically conducting glue.
http://www.w3.org/ns/prov#wasQuotedFrom
  • patentgenius.com