About: http://webisa.webdatacommons.org/436177618

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This bonding method is for bonding semiconductor or conductor such as silicon to insulator such as borosilicate glass without necessity of bonding pads, and the details thereof are described, for example, in U.S. Pat. No. 3,397,278.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com