About: http://webisa.webdatacommons.org/436268065

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The semiconductor package of claim 1 wherein the window is a first window and wherein the molding material comprises a second window, the second window exposing a surface of the leadframe structure opposite to the die attach region.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com