About: http://webisa.webdatacommons.org/436345543

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The solder balls 24 can also be comprised of columns or other shapes to provide the appropriate stand-off and appropriate strain relief between multilayer interconnect structure 20 and circuitized substrate 16.Referring to FIG. 3, t
http://www.w3.org/ns/prov#wasQuotedFrom	freepatentsonline.com