| http://www.w3.org/ns/prov#value | - When a solvent which is preferably the same as the solvent contained in the resist liquid applied to the wafer W, a solvent comprising similar chemical components to the resist liquid, a mixture of these solvents, or a solvent including the mixture is applied to the surfaces of the wafer W before the resist liquid is dropped, the amount of the resist liquid applied to the wafer W can be reduced.
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