About: http://webisa.webdatacommons.org/438415143

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com