About: http://webisa.webdatacommons.org/439091371

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	As described above, according to this embodiment, bonding between Cu and an impurity such as carbon or hydrogen is prevented by positively forming the CuO film 4, and the CuO film 4 is reduced to form the Cu wiring layer 5.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com