About: http://webisa.webdatacommons.org/43927294

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Referring to FIG. 6 and FIG. 7, in process step 260, the excess flowable dielectric material 115 outside of the trenches 103' and masking layer 102 is removed through a process such as chemical mechanical polishing (CMP), an etch, or a
http://www.w3.org/ns/prov#wasQuotedFrom	patents.com