About: http://webisa.webdatacommons.org/440898091

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The ball bonding pads 44 can also be plated with a metal, such as Ni or Au, to facilitate a subsequent solder reflow process wherein the ball contacts 56 (FIG. 5A) will be bonded to the ball bonding pads 44.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com