| http://www.w3.org/ns/prov#value | - After the bumps 198 are connected to the copper traces 84 using a thermal pressing process, a polymer material 94, such as epoxy or polyimide, can be formed between the passivation layer 10 of the semiconductor chip 202 and the polymer layer 88 of the flexible circuit film 82, and enclosing the bumps 198.
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