PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 1C shows a third step in which a metal plating layer 3 having a superior wettability to solder or conductive adhesive is formed on the rough surface 1 a in regions other than the region in which the plating resist 2 is formed.
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