| http://www.w3.org/ns/prov#value | - Certain imaging sensors of the invention have a cross-sectional area (i.e. an x-y dimension, also known as packaged chip size) that is 2 mm??2 mm or less, such as 1.8 mm??1.8 mm or less, and yet have a matrix resolution of 400??400 or greater, such as 640??480 or greater.
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