| http://www.w3.org/ns/prov#value | - Surface mounted components, such as flip chips, ball grid arrays (BGAs), and chip-scale packages (CSPs), are developed for use in high-volume production.Nordson YESTECH???s M1m AOI has specific design enhancements to directly address the unique inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes.
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