About: http://webisa.webdatacommons.org/444336407

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Therefore, a diffusion barrier material is formed onto dielectric materials and other materials in the integrated circuits to surround the Cu and prevent diffusion of the Cu into the integrated circuit materials.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com