PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • As shown in FIG. 4b, the semiconductor chip or ???die??? 31, including integrated circuits, is attached by the bonding agent 50 to the center of the tape film 40 on which the output terminals 32 are arranged.
http://www.w3.org/ns/prov#wasQuotedFrom
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