About: http://webisa.webdatacommons.org/447730729

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	A planarization process, such as a chemical mechanical polishing (CMP) process is performed on the surface of the fourth interlayer insulating film 44 such that the surface of the fourth interlayer insulating film 44 is planarized.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com