| http://www.w3.org/ns/prov#value | - Moreover, in FIG. 2, the arrangement of the TCP substrate 17 is identical to that of FIG. 9(a), in which a wiring pattern is formed by copper foil and the like on a base film made of a material such as polyimide, and the driving ICs and the reading ICs 16 are disposed (mounted) thereon.
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