| http://www.w3.org/ns/prov#value | - In another embodiment, FIG. 6 a shows a wafer-form temporary carrier or dummy wafer substrate 160, similar to carrier 120, containing sacrificial base material such as silicon, polymer, polymer composite, metal, ceramic, glass, glass epoxy, beryllium oxide, or other suitable low-cost, rigid material or bulk semiconductor material for structural support.
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