About: http://webisa.webdatacommons.org/451552175

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	20090206456MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A COPPER SURFACE - A module includes a substrate including a first copper surface and a semiconductor chip.
http://www.w3.org/ns/prov#wasQuotedFrom	faqs.org