About: http://webisa.webdatacommons.org/451822164

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 51F depicts the state of the process after application of a second photoresist 952??? and patterning of the resist to form openings 958 where solder bumps or other bonding material is to be deposited.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com