About: http://webisa.webdatacommons.org/455450973

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Furthermore, with the above-mentioned bonding method, no stress, such as caused by heat and pressure during the conventional bonding process, is applied onto the wiring substrate 1 and the LED element 4.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com