About: http://webisa.webdatacommons.org/455973575

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	However, one of the drawbacks of using sulfuric acid as the electroplating chemical is that the sulfuric acid has a tendency to damage the copper seed layer and cause poor gap-filling.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com