About: http://webisa.webdatacommons.org/456060487

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Some vendors, such as Intel, have resorted to gluing completed chips together, while University of Rochester researchers have designed and built 3-D circuits layer by layer internally.
http://www.w3.org/ns/prov#wasQuotedFrom	idg.no