PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 3a is a side view of a multi-tier flip-chip assembly 300 using a double-sided flip-chip die 304, thereby requiring no bond wires.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com.au