PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Furthermore, process gases such as O2, CF4, CL2, NH2, etc., can be introduced onto the wafer surface in the upper section.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com