| http://www.w3.org/ns/prov#value | - If it is desired to attach an optical component such as a lens or fiber using a solder or other metal bonding surface (such as A10 bonding described by EP 0895111A1 and U.S. Pat. No. 6,034,405), the solder may be provided using an etched metal shadow mask in contact with the base wafer 110 at this time.
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