| http://www.w3.org/ns/prov#value | - 2603Oct 31, 2007Apr 26, 2011Megica CorporationChip structure and process for forming the sameUS7944048 *Aug 7, 2007May 17, 2011Monolithic Power Systems, Inc.Chip scale package for power devices and method for making the sameUS7944057Dec 4, 2009May 17, 2011Round Rock Research, LlcBond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the
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