| http://www.w3.org/ns/prov#value | - 06Oct 23, 2007Micron Technology, Inc.Support elements for semiconductor devices with peripherally located bond padsUS7303947 *Jul 13, 2005Dec 4, 2007Lockheed Martin CorporationSource bridge for cooling and/or external connectionUS7423336Apr 8, 2002Sep 9, 2008Micron Technology, Inc.Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including t
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