| http://www.w3.org/ns/prov#value | - Accordingly, there is a need for a method and apparatus for drying wafers during the production of integrated circuits which does not require the use of a self-contained drying module, which does not result in flammable mist or fogs, which reduces the usage of expensive chemicals, and in which ultrasonic vibrations are used to improve the efficiency and increase the throughput of the overall dryin
|
