| http://www.w3.org/ns/prov#value | - According to another embodiment of the present invention, there is provided solder stripping non-peroxide solution for stripping tin/lead alloy from circuit boards particularly solder-mask-over-bare copper type circuit boards, the solution including an aqueous solution of a nitro-substituted aromatic compound, fluoboric acid, boric acid, a hydroxyphenol, ammonium nitrate, nitric acid and thiourea
|
