| http://www.w3.org/ns/prov#value | - c component with flexible contacting pads and method for producing the electronic componentUS7345368 *Dec 3, 2004Mar 18, 2008Rohm Co., Ltd.Semiconductor device and the manufacturing method for the sameUS7423336Apr 8, 2002Sep 9, 2008Micron Technology, Inc.Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor d
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