| http://www.w3.org/ns/prov#value | - carbon layer depositionUS7320734Aug 22, 2003Jan 22, 2008Applied Materials, Inc.Plasma immersion ion implantation system including a plasma source having low dissociation and low minimum plasma voltageUS7323401Aug 8, 2005Jan 29, 2008Applied Materials, Inc.Semiconductor substrate process using a low temperature deposited carbon-containing hard maskUS7335611Aug 8, 2005Feb 26, 2008Applied Materials,
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