| http://www.w3.org/ns/prov#value | - chines CorporationVertically stacked memory chips in FBGA packagesUS6787393 *Feb 24, 2003Sep 7, 2004Samsung Electronics Co., Ltd.Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor packageUS6924550 *Apr 5, 2004Aug 2, 2005Micron Technology, Inc.comprises die and an interposer substrate whic
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