| http://www.w3.org/ns/prov#value | - Accordingly, at the portion other than the wiring portion at which copper or copper alloy is to be embedded, the exposed barrier layer must be removed by CMP. However, as the barrier layer conductor is harder than copper or copper alloy, a sufficiently high polishing rate is hardly obtained and flatness often worsens, even if a combination of the polishing materials for copper or copper alloy is s
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