| http://www.w3.org/ns/prov#value | - According to the present invention, the foregoing and other advantages are achieved in part by a method of manufacturing a semiconductor device, the method comprising: forming an opening in a dielectric layer, comprising a low-k material having a pendant functional group, overlying a lower conductive feature, the opening defined by sidewalls of the low-k dielectric layer; depositing a sealant laye
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