| http://www.w3.org/ns/prov#value | - conducting fluid to the fluid passage; means for supplying a slurry to the wafer; means for heating the wafer while the wafer face is being polished, the heating means including means for changing the composition of the slurry; and a heating element heating the fluid that flows through the hollow interior, the rate of flow of fluid through the hollow interior being controllable, and the temperatu
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