| http://www.w3.org/ns/prov#value | - A chemical mechanical polishing apparatus, comprising:a rotatable polishing pad; a slurry supply to provide slurry to the polishing pad; and a carrier head including a base and a flexible membrane extending beneath the base to define a pressurizable chamber, a lower surface of the flexible membrane providing a mounting surface for applying a load to a substrate, the flexible membrane including an
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