| http://www.w3.org/ns/prov#value | - ch, LlcBond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesClassifications U.S. Classification438/125, 257/E25.013, 257/E21.499International ClassificationH01L25/065, H01L21/00Cooperative ClassificationH01L2224/92247, H01L2225/06527, H01L2224/48227, H01L2224/32145, H01L2224/32225, H01L2225/06586, H01
|
