| http://www.w3.org/ns/prov#value | - 0444] According to the present invention, since a frame-shaped insulating member is not necessarily required for preventing a hot-melt type member from intruding a space portion between an EPROM and a printed circuit board, an assemblage of the EPROM having a simple structure can be obtained. [0445] In the present invention, such as a sheet of a thermo-setting resin can be used as a sealing member
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