| http://www.w3.org/ns/prov#value | - Accordingly, in one embodiment, the present invention is a method of controlling a standoff height in a semiconductor device having an integrated die with a peripheral edge, comprising providing a substrate, depositing a solder resist film laminate layer over the substrate, forming an opening in the solder resist film laminate layer, depositing a metal plate in the opening, forming a first solder
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