| http://www.w3.org/ns/prov#value | - 0Schott AgProcess for making contact with and housing integrated circuitsUS782997925 jul 20069 nov 2010Micron Technology, Inc.High permeability layered films to reduce noise in high speed interconnectsUS78519229 sep 200814 dec 2010Round Rock Research, LlcBond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor d
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