| http://www.w3.org/ns/prov#value | - Accordingly, in one embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a temporary carrier, depositing a seed layer over the temporary carrier, forming a plurality of conductive pillars vertically over the seed layer, forming a conformal insulating layer over the conductive pillars, and forming a conformal conductive layer over the conf
|
