| http://www.w3.org/ns/prov#value | - According to the present invention, since the side faces of the component mounting pad are covered with an organic insulating layer such as a polyimide layer, if the component mounting pad contains a portion that tends to be eroded by solder, such a portion is prevented from contacting the solder; as a result, the pad can survive repeated reworks, and thus the life of the MCM substrate can be exte
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