| http://www.w3.org/ns/prov#value | - 20110186983PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME - According to one embodiment, a package for housing semiconductor element includes: a base plate including a top surface and a recessed portion formed as a downwardly-recessed portion of the top surface; a peripheral wall provided on the top surface of the base plate; a lid provided on an upper side of th
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