| http://www.w3.org/ns/prov#value | - According to one embodiment of the present invention, the base member is a metal, such as KOVAR??? or laminated Cu/Mo/Cu, and the bonding layer is one of a solder and a bond glass having an appropriately selected, and in this case, relatively low, softening-point, along with an appropriate working-point and TEC. According to another embodiment of the present invention, the base member is a ceramic
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